Inspection and testing are essential aspects of bringing a product to market. A key service that adds considerable value to the contract electronic manufacturing of Printed Circuit Board Assembly (PCBA) is the ability to deliver fully tested products, ready to be integrated into the next phase of the product supply chain. By undertaking most of the required testing during the manufacturing process, improvements are accelerated, quality is enhanced and time-to-market is reduced. Our extensive testing capabilities are more than enough for any need. Depending on product design, component selection, production procedure and batch volume, we aim to draw together a testing strategy that increases production yields, reduces manufacturing costs, and delivers the highest product quality. Below are some highlights of our total testing capabilities:

In-Circuit Test(ICT): ICT is a highly accurate form of automated test equipment (ATE.) It is used to test PCBAs by carrying out a “manufacturing defects analysis” (MDA) which looks for common process faults such as open circuits (e.g. something not soldered), short circuits, passive component measurements (resistors and capacitors), diode and transistor orientation, and basic supply voltage measurements.

Flying Probe Test: Flying probe is another type of ATE used in electronic PCB assembly to carry out MDA. We offer passive and active testing on two flying probe platforms. Flying probe testing with Acculogic Scorpion FLS 850 is capable of testing top and bottom side simultaneously.

Automatic Optical Inspection (AOI): In ensuring the accuracy of placement and soldering, AOI is a powerful tool both for continuous process monitoring and to filter out defects for repair.

Function Test: We provide functional testing assistance at any level from PCA to fully integrated systems. We have qualified engineers, technicians and operators to assist in the testing and debugging of your product with the functional testing, as required.

X Ray Inspection: Circuitsify has state of the art machines for both 2D and 5D X Ray that are capable of creating many different analysis reports for SMT, through hole and press fit components, including BGA and other exotic components.

Burn-In Test: Our burn-in testing provides the verifications you need that your products will perform, survive and last in real-life environments.